Intel 3 will be ready to begin manufacturing products in the second half of 2023. Intel 3 leverages further FinFET optimizations and increased EUV to deliver an approximately 18% performance-per-watt increase over Intel 4, along with additional area improvements.With an approximately 20% performance-per-watt increase, along with area improvements, Intel 4 will be ready for production in the second half of 2022 for products shipping in 2023, including Meteor Lake for client and Granite Rapids for the data center. Intel 4 fully embraces EUV lithography to print incredibly small features using ultra-short wavelength light.Intel 7 will be featured in products such as Alder Lake for client in 2021 and Sapphire Rapids for the data center, which is expected to be in production in the first quarter of 2022. Intel 7 delivers an approximately 10% to 15% performance-per-watt increase versus Intel 10nm SuperFin, based on FinFET transistor optimizations.Intel describes the advanced road map in a little more detail: That's the sort of perf jump you'd expect from a new process, and Intel is now marketing it as such.Īfter that we hit 'Intel 4', which was previously referred to as 7nm and will line up against TSMC's N4 process, then we'll get 'Intel 3', and you can guess which rival node that's going head-to-head with. Intel 7 is in volume production right now, and Intel claims giving it a new name is fair because of the 10 - 15% performance per watt gains this node is giving over the previous 10nm SuperFin. First up will be 'Intel 7', which is the new name for the nominally 10nm Enhanced SuperFin node, and lines up against TSMC's N7 process. Which is why Intel is forgetting all that nanometer guff and, from the Enhanced SuperFin node forming the basis of the upcoming Alder Lake CPUs, will be using a new convention.
INTEL S AF5TER NAMEE PC
Through its manufacturing partner, TSMC, AMD has been able to show off nominally 7nm CPUs while Intel's desktop chips still languish on an old 14nm node.īut, as we've regularly pointed out here on PC Gamer, when it comes to transistor density, Intel's 10nm node is far more akin to TSMC's N7, or 7nm node. This has meant Intel increasingly looks behind the times.
From the moment transistors went three dimensional, with the move to FinFET (or Tri-Gate in Intel terminology) in 2011, a single dimension measurement has been rendered entirely irrelevant. The industry has been talking about shifting the way it talks about process nodes for a while, with the nanometer terminology-once used to denote the gate length of a transistor-meaning less and less as time's gone on.